Durable PCB Printed Circuit Board 10 Layer Fr4 1OZ For Engine Control SystemsUL ROHS ISO9001 Rigid Flex Printed Circuit Boards Fr4 Base Material Solid
4Layers Board thickness: 1.20mm, metallized structure
Process structure: alumina ceramic 96%, thermal conductivity 3W
Surface treatment: Shenjin 4U "
Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.
Board Material: Bergquist Aluminium material, Aluminum Base,Copper Base,Ceramic Base materaln.
Communications
Traditional telecommunication equipment, FTTP, VOIP, multimedia services, data networking and IT infrastructure products, wireless infrastructure products, power amplifiers, splitters and combiners, high power transistors, etc.
Computer Peripherals
High end printers, cable modem, wireless routers, IP telephones, consumer and office products, banking system etc.
Consumer
Computers, televisions, cameras, digital video recorders (DVR), handheld products, LED, etc.
Automotive
Passenger safety systems, engine control systems, air bags, traction control products, etc.
High End Computing and Storage
High performance computer and server, mainframe system and storage equipment, memory, etc.
Industry
Power supply, main control panel, monitor, CCTV products,automotive control equipment, industry robot, access control products etc
Medical
Magnetic resonance imaging (MRI), computed tomography (CT), emergency response defibrillation units, patient monitoring, implantable devices, robotic surgery systems, biometrics and diagnostic equipment, etc.
Military
Satellite, radar, airplane, control unit, communication equipment .etc.
Test & Measurement
Power meters, electricity tester, thermal tester, light tester, network tester, gas and oil tester, infrared products, semi-conductor test equipment, DUT and probe cards, wafer inspection systems, etc.
Capability
| | High precision prototype | PCB bulk production |
| Max Layers | 1-28 layers | 1-14 layers |
| MIN Line width(mil) | 3mil | 4mil |
| MIN Line space(mil) | 3mil | 4mil |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
| Board thickness≤2.5mm | 0.2mm | 0.3mm |
| Board thickness＞2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 |
| Board thickness | MAX | 8mm | 7mm |
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm |
| MAX Board size | 610*1200mm | 610*1200mm |
| Max copper thickness | 0.5-6oz | 0.5-6oz |
Immersion Gold/
Gold Plated Thickness | Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u” | |
| Hole copper thick | 25um 1mil | 25um 1mil |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8% | Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8% |
| Outline Tolerance | ≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm | ≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm |
| Impedance | ±10% | ±10% |
| MIN Solder mask bridge | 0.08mm | 0.10mm |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm |
Advantages
1. PCB factory directly
2. Comprehensive quality control system
3. Competitive price
4. Quick turn delivery time from 48hours.
5. Certificates (ISO/UL E354810/RoHS)
6. 9 years experience in exporting service
7. No MOQ/MOV.
8. High quality. Strict through the AOI(Automated Optical Inspection), QA/QC, flying porbe ,Etesting, etc
PCB, FPC process production capability
| Technical ltem | MassProduct | Advanced Technology |
| 2016 | 2017 | 2018 |
| Max.Layer Count | 26L | 36L | 80L |
| Through-hole plate | 2～45L | 2～60L | 2～80L |
| Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" |
| The layer number of FPC | 1～36L | 1～50L | 1～60L |
| Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel |
| Layeredplatelayer | 2～12L | 2～18L | 2～26L |
| Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" |
| Combination of hard and soft layers | 3～26L | 3～30L | 3～50L |
| Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI |
| HDI PCB | 4～45L | 4～60L | 4～80L |
| Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI |
| Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" |
| Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers |
| Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK |
| Build-up Material | FR-4 | FR-4 | FR-4 |
| BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42～8.0mm | 0.38～10.0mm |
| Min.16L(mm) | 0.53 | 1.60～8.0mm | 0.45～10.0mm |
| Min.18L(mm) | 0.63 | 2.0～8.0 | 0.51～10.0mm |
| Min.52L(mm) | 0.8 | 2.50～8.0mm | 0.65～10.0mm |
| MAX(mm) | 3.5 | 10.0mm | 10.0mm |
| Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10～254(10.0mm) |
| Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) |
| BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm |
| Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ |
| Gold thick | 1～40u" | 1～60u" | 1～120u" |
| Nithick | 76～127u" | 76～200u" | 1～250u" |
| Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) |
| Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) |
| 125(5) | 125(5) | 125(5) |
| SKipvia | Yes | Yes | Yes |
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes |
| Laser Hole Filling | Yes | Yes | Yes |
| Technicalltem | Mass Product | Advanced Technolgy |
| 2017year | 2018year | 2019year |
| Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 |
| Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 |
| Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) |
| Min.LineWidth＆space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
| Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
| BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 |
| Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) |
| Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 |
| 2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 |
| ≦3mil | ±0.60 | ±0.60 | ±0.60 |
| Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 |
| Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer |
| Multi-layer overlay | N+N | N+N | N+N |
| N+X+N | N+X+N | N+X+N |
| sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 |
| Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 |
| PTH filling process | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
PCB, FPC main material supplier
| NO | supplier | Supply material name | Material origin |
| 1 | Japan | High frequency materials, PI, covering membrane,Copper berth | Mitsubishi Japan |
| 2 | dupont | High frequency materials, PI, covering film, dry film,Copper berth | Japan |
| 3 | panasonic | High frequency materials, PI, covering membrane,Copper berth | Japan |
| 4 | SanTie | PI, covering membrane | Japan |
| 5 | Born good | FR-4,PI,PP,Copper berth | shenzhen, China |
| 6 | A rainbow | PI, covering membrane,Copper berth | Taiwan |
| 7 | teflon | High frequency materials | The United States |
| 8 | Rogers | High frequency materials | The United States |
| 9 | Nippon Steel | PI, covering membrane,Copper berth | Taiwan |
| 10 | sanyo | PI, covering membrane,Copper berth | Japan |
| 11 | South Asia | FR-4,PI,PP,Copper berth | Taiwan |
| 12 | doosan | FR-4,PP | South Korea |
| 13 | Tai Yao plate | FR-4,PP,Copper berth | Taiwan |
| 14 | Alight | FR-4,PP,Copper berth | Taiwan |
| 15 | Yaoguang | FR-4,PP,Copper berth | Taiwan |
| 16 | Yalong | FR-4,PP | The United States |
| 17 | ISOAL | FR-4,PP | Japan |
| 18 | OAK | Buried, buried resistance, PP | Japan |
| 19 | United States 3M | FR-4,PP | The United States |
| 20 | Bergs | Copper and aluminum matrix | Japan |
| 21 | The sun | ink | Taiwan |
| 22 | Murata | ink | Japan |
| 23 | generous andbenevolent | PI, covering membrane,Copper berth | China's jiangxi |
| 24 | Yasen | PPI, covering membrane | China jiangsu |
| 25 | Yong Sheng Tai | ink | China guangdong panyu |
| 26 | mita | ink | Japan |
| 27 | Transcript | ceramic material | Taiwan |
| 28 | HOME | ceramic material | Japan |
| 29 | Fe-Ni-Mn | Alloy Invar, Section Steel | Taiwan |
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
- PCB Production Service.
- PCB FPC design Service.
- PCB Assembly Service. (SMT, BGA, DIP)
- PCBA Housing assembly serivce.
- PCBA Final Functional Testing.
- PCB PCBA Copy Service.
- Electronic Components Purchasing & BOM List Purchasing Services.
- PCB SMT Stencil. (Laser cut & Etching)
-
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
7. IC programming
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.
- PCB Assembly on SMT and DIP
- PCB schematic drawing/ layout /producing
- PCBA clone/change board
- Components sourcing and purchasing for PCBA
- Enclosure design and plastic injection molding
- Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
- IC programming
Product Tags:
|
|
Durable PCB Printed Circuit Board 10 Layer Fr4 1OZ For Engine Control Systems Images
|
